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Non-Sag, Epoxy Adhesive Binder
Purpose:
Gelbond Paste is a two-component, solvent-free, moisture insensitive, structural epoxy adhesive. Gelbond Paste is designed as a structural adhesive and binder.
Uses:
Structural bonding under damp or dry conditions, grouting, structural grouting and as a structural adhesive.
Suggested Applications:
 | Concrete |
| Masonry |
| Tile |
| Stone |
| Ceramics |
| Grouting dowels, anchors, rebar, bolts and metal anchors |
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Packaging
1 and 2 gal. units
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 Physical Properties |
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Test |
Results |
ASTM
SPECIFICATIONS |
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Mix Ratio (by volume) |
1:1 |
N/A |
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ASTM C-881 Gel Time |
35 minutes |
30 minutes min. |
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ASTM C-882
Bond Strength (2 days) |
2,232 psi |
1,000 psi min. |
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ASTM C-882
Bond Strength (14 days) |
2,460 psi |
1,500 psi min. |
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ASTM D-570
Absorption |
0.63% |
1.0% max.
(I, II, IV, V) |
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ASTM C-881 Consistency |
0 (no flow) |
1/4" flow max. |
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ASTM D-695
Compressive Strength |
11,236 psi |
5,000 psi (II)
8,000 psi (I, V)
10,000 psi (IV)
min. |
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ASTM D-695
Compressive Modulus |
250,100 psi |
90,000 psi (II)
150,000 psi (I, V)
200,000 psi (IV)
min. |
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ASTM D-638
% Elongation at Break |
2.56% |
1.0% min.
(I, II, IV, V) |
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ASTM D-732 Shear Strength |
3,550 psi |
N/A |
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ASTM D-790 Flexural Strength |
5,582 psi |
N/A |
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ASTM C-884 Shrinkage |
Pass |
N/A |
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ASTM C-884
Thermal Compatibility |
Pass |
N/A |
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 Product Standards & Approvals |
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| ASTM C-881 Type I, II, IV and V Grade 3, Class B and C |
03 30 00 EPOXY COATINGS |
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 Product Downloads |
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 View the Epoxy Adhesive Products reference chart.
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